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CAS number : 616-47-7
molecular formula : C4H6N2
EINECS : 210-484-7
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Product name: 1-Methylimidazole
CAS: 616-47-7
Molecular formula: C4H6N2
EINECS number: 210-484-7
Melting point | −60 °C(lit.) |
Boiling Point | 198 °C(lit.) |
Density | 1.03 g/mL at 25 °C(lit.) |
Vapor pressure | 0.4 mm Hg ( 20 °C) |
Refractive Index | n20/D 1.495(lit.) |
Flash point | 198 °F |
Storage conditions | Store below +30°C. |
Solubility | Soluble in chloroform (a little), methanol (a little) |
Form | liquid |
Acidity coefficient (pKa) | 6.95(at 25℃) |
N-methylimidazole is 1-methylimidazole, which is mainly used as an organic synthesis intermediate, ionic liquid and resin curing agent, adhesive, etc., such as the synthesis of deoxyribonucleic acid and acetylation catalyst, as well as for casting, bonding and fiberglass. Therefore, optimizing the synthesis process of N-methylimidazole has great application value and practical significance. At present, the research on the preparation method of N-methylimidazole mainly focuses on 6 methods: 1,2-dicarbonyl compound synthesis method, VanLeusen synthesis method, Phillips synthesis method, Wohl-Marckwald synthesis method, Witting synthesis method and N-methylation synthesis method.
N-methylimidazole is an important raw material for the synthesis of pharmaceutical intermediates, used to prepare losartan, nitrazofenone, 1-methylimidazole-5-carbonyl chloride hydrochloride and naphthiazol hydrochloride, etc. In the field of pesticides, it is widely used to synthesize fungicides and plant growth promoters.
For example: N-methylimidazole is used as a cationic matrix to undergo quaternization reaction to synthesize imidazole ionic liquids; in addition, N-methylimidazole is also used as a curing agent and adhesive for other resins such as epoxy resins; N-methylimidazole is also widely used in the fields of casting and glass fiber reinforced plastics.
A continuous preparation method for N-methylimidazole, using Hβ molecular sieve as catalyst, in a tubular reactor, mixed ammonia containing ammonia water and methylamine, and mixed aldehyde containing formaldehyde and glyoxal undergo gas phase catalytic reaction, and the obtained reaction product is separated by distillation to obtain N-methylimidazole.
The specific steps are:
(1) adding Hβ molecular sieve catalyst to a tubular reactor, heating and vaporizing the raw materials of mixed ammonia and mixed aldehyde, and then continuously introducing them into the tubular reactor, and condensing the mixed gas generated by the gas-phase catalytic reaction to obtain a crude N-methylimidazole product;
(2) adding the crude N-methylimidazole product obtained in step (1) to a vacuum side distillation tower for distillation separation, controlling the pressure of the vacuum side distillation tower to 0.20MPa, the side discharge of the vacuum side distillation tower is N-methylimidazole with a content of ≥99.0wt%, and water with a purity of more than 99.0wt% is obtained at the top of the vacuum side distillation tower, and the bottom discharge of the vacuum side distillation tower is a high-boiling point mixture containing trace amounts of N-methylimidazole;
(3) adding the water with a purity of more than 99.0wt% obtained at the top of the vacuum side distillation tower to a distillation tower, and after distillation separation, the aqueous solution of mixed ammonia and mixed aldehyde obtained at the top of the distillation tower is recycled as a raw material, and the bottom discharge of the distillation tower is water.
Appearance: colorless transparent liquid, melting point: -60℃, boiling point: 198℃, density d20/4=1.036g/ml. Content: ≥99%.
1. Mainly used as curing agent for epoxy resin and other resins; used in casting, bonding and FRP fields.
2. Organic synthesis intermediate and resin curing agent, adhesive, etc. Can be used in casting, bonding and FRP fields.
3. Organic synthesis intermediate and used as epoxy resin curing agent, adhesive, etc.; can be widely used in epoxy resin bonding, coating, casting, encapsulation, impregnation and composite materials, etc.
4. Used as organic synthesis intermediate and resin curing agent, adhesive, etc.
Product name: 1-Methylimidazole
CAS: 616-47-7
Molecular formula: C4H6N2
EINECS number: 210-484-7
Melting point | −60 °C(lit.) |
Boiling Point | 198 °C(lit.) |
Density | 1.03 g/mL at 25 °C(lit.) |
Vapor pressure | 0.4 mm Hg ( 20 °C) |
Refractive Index | n20/D 1.495(lit.) |
Flash point | 198 °F |
Storage conditions | Store below +30°C. |
Solubility | Soluble in chloroform (a little), methanol (a little) |
Form | liquid |
Acidity coefficient (pKa) | 6.95(at 25℃) |
N-methylimidazole is 1-methylimidazole, which is mainly used as an organic synthesis intermediate, ionic liquid and resin curing agent, adhesive, etc., such as the synthesis of deoxyribonucleic acid and acetylation catalyst, as well as for casting, bonding and fiberglass. Therefore, optimizing the synthesis process of N-methylimidazole has great application value and practical significance. At present, the research on the preparation method of N-methylimidazole mainly focuses on 6 methods: 1,2-dicarbonyl compound synthesis method, VanLeusen synthesis method, Phillips synthesis method, Wohl-Marckwald synthesis method, Witting synthesis method and N-methylation synthesis method.
N-methylimidazole is an important raw material for the synthesis of pharmaceutical intermediates, used to prepare losartan, nitrazofenone, 1-methylimidazole-5-carbonyl chloride hydrochloride and naphthiazol hydrochloride, etc. In the field of pesticides, it is widely used to synthesize fungicides and plant growth promoters.
For example: N-methylimidazole is used as a cationic matrix to undergo quaternization reaction to synthesize imidazole ionic liquids; in addition, N-methylimidazole is also used as a curing agent and adhesive for other resins such as epoxy resins; N-methylimidazole is also widely used in the fields of casting and glass fiber reinforced plastics.
A continuous preparation method for N-methylimidazole, using Hβ molecular sieve as catalyst, in a tubular reactor, mixed ammonia containing ammonia water and methylamine, and mixed aldehyde containing formaldehyde and glyoxal undergo gas phase catalytic reaction, and the obtained reaction product is separated by distillation to obtain N-methylimidazole.
The specific steps are:
(1) adding Hβ molecular sieve catalyst to a tubular reactor, heating and vaporizing the raw materials of mixed ammonia and mixed aldehyde, and then continuously introducing them into the tubular reactor, and condensing the mixed gas generated by the gas-phase catalytic reaction to obtain a crude N-methylimidazole product;
(2) adding the crude N-methylimidazole product obtained in step (1) to a vacuum side distillation tower for distillation separation, controlling the pressure of the vacuum side distillation tower to 0.20MPa, the side discharge of the vacuum side distillation tower is N-methylimidazole with a content of ≥99.0wt%, and water with a purity of more than 99.0wt% is obtained at the top of the vacuum side distillation tower, and the bottom discharge of the vacuum side distillation tower is a high-boiling point mixture containing trace amounts of N-methylimidazole;
(3) adding the water with a purity of more than 99.0wt% obtained at the top of the vacuum side distillation tower to a distillation tower, and after distillation separation, the aqueous solution of mixed ammonia and mixed aldehyde obtained at the top of the distillation tower is recycled as a raw material, and the bottom discharge of the distillation tower is water.
Appearance: colorless transparent liquid, melting point: -60℃, boiling point: 198℃, density d20/4=1.036g/ml. Content: ≥99%.
1. Mainly used as curing agent for epoxy resin and other resins; used in casting, bonding and FRP fields.
2. Organic synthesis intermediate and resin curing agent, adhesive, etc. Can be used in casting, bonding and FRP fields.
3. Organic synthesis intermediate and used as epoxy resin curing agent, adhesive, etc.; can be widely used in epoxy resin bonding, coating, casting, encapsulation, impregnation and composite materials, etc.
4. Used as organic synthesis intermediate and resin curing agent, adhesive, etc.